Partner: W. Swieszkowski


Recent publications
1.Rinoldi C., Kijeńska-Gawrońska E., Heljak M., Jaroszewicz J., Kamiński A., Khademhosseini A., Tamayol A., Swieszkowski W., Mesoporous Particle Embedded Nanofibrous Scaffolds Sustain Biological Factors for Tendon Tissue Engineering, ACS Materials Au, ISSN: 2694-2461, DOI: 10.1021/acsmaterialsau.3c00012, Vol.3, No.6, pp.636-645, 2023
2.Kowiorski K., Heljak M., Strojny-Nędza A., Bucholc B., Chmielewski M., Djas M., Kaszyca K., Zybała R., Małek M., Swieszkowski W., Chlanda A., Compositing graphene oxide with carbon fibers enables improved dynamical thermomechanical behavior of papers produced at a large scale, , DOI: 10.1016/j.carbon.2023.02.009, Vol.206, pp.26-36, 2023
Abstract:

This article discusses the morphology and thermomechanical properties of graphene oxide (GO) paper sheets and GO paper composites reinforced with carbon fibers. GO paper was fabricated using GO paste obtained by the condensation of GO aqueous solution synthesized using the Hummers' method. Carbon fibers were implemented to improve the mechanical properties of the pristine GO paper. All the investigated papers were subjected to thermal treatment to check thermo-related morphological and mechanical properties. The results presented in this study allowed for the deeper insight into morphological, structural, and mechanical volume and surface-related properties of pristine GO and GO-based composite materials reinforced with carbon fibers. We showed that there are two important factors that should be taken into consideration for the design and fabrication of GO-based papers. These factors were the concentration of the reinforcing agent and the thermal reduction of the papers. Both factors have influenced the final properties of the resulting GO-based papers. For the first time, it was revealed how the addition of the reinforcing material affects the GO paper thermal expansion coefficient.

Keywords:

Flake graphene, Graphene oxide, Graphene oxide paper, Carbon fibers, Mechanical properties

Affiliations:
Kowiorski K.-other affiliation
Heljak M.-Warsaw University of Technology (PL)
Strojny-Nędza A.-Institute of Electronic Materials Technology (PL)
Bucholc B.-IPPT PAN
Chmielewski M.-Institute of Electronic Materials Technology (PL)
Djas M.-other affiliation
Kaszyca K.-Lukasiewicz Institute of Microelectronics and Photonics (PL)
Zybała R.-Warsaw University of Technology (PL)
Małek M.-other affiliation
Swieszkowski W.-other affiliation
Chlanda A.-Warsaw University of Technology (PL)