Partner: Du Jingtao


Recent publications
1.Rybak D., Jingtao D., Nakielski P., Rinoldi C., Kosik-Kozioł A., Zakrzewska A., Haoyang W., Jing L., Li X., Yunlong Y., Ding B., Pierini F., NIR-Light Activable 3D Printed Platform Nanoarchitectured with Electrospun Plasmonic Filaments for On Demand Treatment of Infected Wounds, ADVANCED HEALTHCARE MATERIALS, ISSN: 2192-2659, DOI: 10.1002/adhm.202404274, pp.2404274-1-17, 2024
Abstract:

Bacterial infections can lead to severe complications that adversely affect wound healing. Thus, the development of effective wound dressings has become a major focus in the biomedical field, as current solutions remain insufficient for treating complex, particularly chronic wounds. Designing an optimal environment for healing and tissue regeneration is essential. This study aims to optimize a multi-functional 3D printed hydrogel for infected wounds. A dexamethasone (DMX)-loaded electrospun mat, incorporated with gold nanorods (AuNRs), is structured into short filaments (SFs). The SFs are 3D printed into gelatine methacrylate (GelMA) and sodium alginate (SA) scaffold. The photo-responsive AuNRs within SFs significantly enhanced DXM release when exposed to near-infrared (NIR) light. The material exhibits excellent photothermal properties, biocompatibility, and antibacterial activity under NIR irradiation, effectively eliminating Staphylococcus aureus and Escherichia coli in vitro. In vivo, material combined with NIR light treatment facilitate infectes wound healing, killing S. aureus bacteria, reduced inflammation, and induced vascularization. The final materials’ shape can be adjusted to the skin defect, release the anti-inflammatory DXM on-demand, provide antimicrobial protection, and accelerate the healing of chronic wounds.

Affiliations:
Rybak D.-IPPT PAN
Jingtao D.-other affiliation
Nakielski P.-IPPT PAN
Rinoldi C.-other affiliation
Kosik-Kozioł A.-IPPT PAN
Zakrzewska A.-IPPT PAN
Haoyang W.-other affiliation
Jing L.-other affiliation
Li X.-Donghua University (CN)
Yunlong Y.-other affiliation
Ding B.-Donghua University (CN)
Pierini F.-IPPT PAN