Partner: Alberto Vomiero

Luleå University of Technology (SE)

Ostatnie publikacje
1.Alvi S., Milczarek M., Jarząbek D.M., Hedman D., Kohan M.G., Levintant-Zayonts N., Vomiero A., Akhtar F., Enhanced mechanical, thermal and electrical properties of high-entropy HfMoNbTaTiVWZr thin film metallic glass and its nitrides, Advanced Engineering Materials, ISSN: 1438-1656, DOI: 10.1002/adem.202101626, pp.2101626-1-10, 2022

Streszczenie:

The inception of high-entropy alloy promises to push the boundaries for new alloy design with unprecedented properties. This work reports entropy stabilisation of an octonary refractory, HfMoNbTaTiVWZr, high-entropy thin film metallic glass, and derived nitride films. The thin film metallic glass exhibited exceptional ductility of ≈60% strain without fracture and compression strength of 3 GPa in micro-compression, due to the presence of high density and strength of bonds. The thin film metallic glass shows thermal stability up to 750 °C and resistance to Ar-ion irradiation. Nitriding during film deposition of HfMoNbTaTiVWZr thin film of strong nitride forming refractory elements results in deposition of nanocrystalline nitride films with compressive strength, hardness, and thermal stability of up to 10 GPa, 18.7 GPa, and 950 °C, respectively. The high amount of lattice distortion in the nitride films leads to its insulating behaviour with electrical conductivity as low as 200 S cm−1 in the as-deposited film. The design and exceptional properties of the thin film metallic glass and derived nitride films may open up new avenues of development of bulk metallic glasses and the application of refractory-based high entropy thin films in structural and functional applications.

Afiliacje autorów:

Alvi S.-Luleå University of Technology (SE)
Milczarek M.-IPPT PAN
Jarząbek D.M.-IPPT PAN
Hedman D.-Luleå University of Technology (SE)
Kohan M.G.-Luleå University of Technology (SE)
Levintant-Zayonts N.-IPPT PAN
Vomiero A.-Luleå University of Technology (SE)
Akhtar F.-Luleå University of Technology (SE)
100p.
2.Alvi S., Jarząbek D.M., Kohan M.G., Hedman D., Jenczyk P., Natile M.M., Vomiero A., Akhtar F., Synthesis and mechanical characterization of a CuMoTaWV high-entropy film by magnetron sputtering, ACS Applied Materials and Interfaces, ISSN: 1944-8244, DOI: 10.1021/acsami.0c02156, Vol.12, No.18, pp.21070-21079, 2020

Streszczenie:

Development of high-entropy alloy (HEA) films is a promising and cost-effective way to incorporate these materials of superior properties in harsh environments. In this work, a refractory high-entropy alloy (RHEA) film of equimolar CuMoTaWV was deposited on silicon and 304 stainless-steel substrates using DC-magnetron sputtering. A sputtering target was developed by partial sintering of an equimolar powder mixture of Cu, Mo, Ta, W, and V using spark plasma sintering. The target was used to sputter a nanocrystalline RHEA film with a thickness of ~900 nm and an average grain size of 18 nm. X-ray diffraction of the film revealed a body-centered cubic solid solution with preferred orientation in the (110) directional plane. The nanocrystalline nature of the RHEA film resulted in a hardness of 19 ± 2.3 GPa and an elastic modulus of 259 ± 19.2 GPa. A high compressive strength of 10 ± 0.8 GPa was obtained in nanopillar compression due to solid solution hardening and grain boundary strengthening. The adhesion between the RHEA film and 304 stainless-steel substrates was increased on annealing. For the wear test against the E52100 alloy steel (Grade 25, 700-880 HV) at 1 N load, the RHEA film showed an average coefficient of friction (COF) and wear rate of 0.25 (RT) and 1.5 (300 °C), and 6.4 × 10^–6 mm^3/N m (RT) and 2.5 × 10^–5 mm^3/N m (300 °C), respectively. The COF was found to be 2 times lower at RT and wear rate 10^2 times lower at RT and 300 °C than those of 304 stainless steel. This study may lead to the processing of high-entropy alloy films for large-scale industrial applications.

Słowa kluczowe:

high-entropy alloys, magnetron sputtering, spark plasma sintering, mechanical properties, wear

Afiliacje autorów:

Alvi S.-Luleå University of Technology (SE)
Jarząbek D.M.-IPPT PAN
Kohan M.G.-Luleå University of Technology (SE)
Hedman D.-Luleå University of Technology (SE)
Jenczyk P.-IPPT PAN
Natile M.M.-other affiliation
Vomiero A.-Luleå University of Technology (SE)
Akhtar F.-Luleå University of Technology (SE)
200p.